Wafer Level Packaging Market Expected to Reach $23.6 Billion, Globally, by 2030 at 18.8% CAGR
Leading Market Players:
• Jiangsu Changjiang Electronics Technology Co. Ltd,
• Fujitsu,
• Lam Research Corporation,
• Qualcomm Technologies, Inc.,
• Tokyo Electron Ltd.,
• Deca Technologies,
The report provides a detailed analysis of these key players of the global wafer level packaging market. These players have adopted different strategies such as product development and product launch to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.