Advanced Packaging Market Projected to Hit $64.19 Billion By 2027 | Allied Market Research
The global advanced packaging market size was valued at $29.42 billion in 2019 and projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027.
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Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. Advanced packaging allows the chip to be connected to a circuit board.